EME (epoxy molding compounds) possess excellent moldability, good mechanical and electrical properties, and high reliability. It is mainly used for semiconductor component packaging, especially for IC (integrated circuits), diodes, transistors, photocouplers, and coils.
IC packaging and molding material, with high molding performance and reliability.
Diode packaging and molding material, with high molding performance and reliability.
Transistor packaging and molding material, with high molding performance and reliability.
Photocoupler packaging and molding material, with high molding performance and reliability.
EME-1200, EME-1100.
EME-5961.
EME-E120G, EME-110G, EME-E210.
E190.
EC-15L, EC-20.
EC-15GN.
EC-50.